aboutsummaryrefslogtreecommitdiff
path: root/hardware/fab/m256c/README
diff options
context:
space:
mode:
Diffstat (limited to 'hardware/fab/m256c/README')
-rw-r--r--hardware/fab/m256c/README42
1 files changed, 42 insertions, 0 deletions
diff --git a/hardware/fab/m256c/README b/hardware/fab/m256c/README
new file mode 100644
index 0000000..406d6ec
--- /dev/null
+++ b/hardware/fab/m256c/README
@@ -0,0 +1,42 @@
+PCB Fabrication Package. Google Mega2560 Arduino Rev. C 2011-03-23
+
+Gerber Files in RS-274-X Format
+ m256_tslk.gbr - Top Silkscreen
+ m256_tpst.gbr - Top Solderpaste (Stencil)
+ m256_tmsk.gbr - Top Soldermask
+ m256_tcmp.gbr - Top Copper
+ m256_bcmp.gbr - Bottom Copper
+ m256_bmsk.gbr - Bottom Soldermask
+ m256_bslk.gbr - Bottom Silkscreen
+
+Drill files:
+ m256_drl.drl - Excellon Drill file
+
+Fab drawing:
+
+ m256_fab.pdf
+
+Coordinates:
+
+ m256.mnt - Top SMD coordinates
+
+Board dimensions/outline included as zero width trace in silkscreen layer
+for reference. Board is made from 0.062" FR4 with 1oz copper on all
+layers. Minimum trace/space is 6/6 mils.
+
+NOTE: Board contains 3 plated slots, each slot is marked at the two ends
+and center with 0.041" drills.
+
+Board layers stacked as follows:
+
+ Top Silkscreen (Black)
+ Top Soldermask (White)
+ Top Copper (1oz)
+ FR4 (62 mil)
+ Bottom Copper (1oz)
+ Bottom Soldermask (White)
+ Bottom Silkscreen (Black)
+
+Process the silkscreen layer against the soldermask layer to prevent
+overlapping silkscreen on the pads through mask openings.
+